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(11)    Patent No :    AP 2366    (73) Applicant(s)       
(21)    Application No :    AP/P/2006/003779    OUTOTEC OYJ, Riihitontuntie 7 E, P.O. Box 86, FI-02200       
(22)    Filing Date :    06.04.2005    Finland       
(24)    Date of Grant &    20.02.2012           
(45)    Publication :

(30)    Priority Data            (72) Inventors   
    (33) Country    (31) Number    (32) Date    ACQUADRO Antony, Australia   
    AU    2004901900    07.04.2004    BALDOCK Brian Ross, Australia   
                HUGHES Stephen Peter, Australia   
                et al       
                (74) Representative   
(84)    Designated State           
    ZM            FISHER CORMACK & BOTHA   
(51)    International    Classification    C22B15/06 (2006.01)    C22B 15/00 (2006.01)   
            C22B 15/10 (2006.01)       
(54)    Title

Process for copper converting

(57)    Abstract

The process for converting a copper sulphide matte to blister copper, is achieved by adding the copper sulphide matte and flux to a suitable agitated slag phase; and injecting, from a discharge tip at the lower end of a

top -submerged lance, an oxidizing gas suitable for reacting with the matte to produce blister copper which forms or adds to a continuous blister copper phase below the slag phase. The lance tip is located within the slag phase at a

depth enabling the injected gas to agitate the slag phase, and to react with copper sulphide matte dispersed therein, while precluding a substantial

(56)    Documents Cited :    US 3 664 823 A   US 5 374 299 A


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