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(11)    Patent No :    AP 2226    (73) Applicant(s)       
(21)    Application No :    AP/P/2007/004088    NAGRAID S.A., Crêt- Du-Locle 10, CH-2322 Le       
            Crêt-Du-Locle,       
                   
(22)    Filing Date :    01.02.2006    Switzerland       
(24)    Date of Grant &    29.03.2011           
                   
(45)    Publication :

(30)    Priority Data                    (72) Inventors   
    (33) Country    (31) Number    (32) Date    DROZ François, Switzerland   
    EP            05100694.8    01.02.2005       
    EP            05109094.2    30.09.2005    (74) Representative   
(84)    Designated State                   
    BW    GM    GH    KE    LS    MW    MZ   NA   SL    GALLOWAY & COMPANY   
    SD    SZ    T Z    UG    ZM    ZW        ZIMBABWE   
                                   
(51)    International    Classification    GO6K 19/077 (2006.01)   

(54)    Title

Method for applying an eletronic assembly to a substrate and a device for applying said assembly

(57)    Abstract

The aim of this invention is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate.

This aim is achieved by a placement process on a support, called substrate (7), of at least one electronic assembly consisting of a chip (4) including at least one electric contact (5, 5') on one of its faces, said contact (5, 5') being connected to a segment (3,3') of conductive track, and said placement being carried out by means of a placement device (6) holding and positioning said assembly on the substrate (7), characterized in that it includes the following steps:

-    formation of a segment (3, 3') of conductive track having a predetermined outline,

-    transfer of the track segment (3, 3') onto the placement device (6),

-    seizing of the chip (4) with the placement device (6) carrying the track segment (3, 3') in such a way that said track segment (3, 3') is placed on at least one contact (5, 5') of the chip (4).

-    placement of the electronic assembly consisting of the chip (4) and the track

segment (3, 3') at a predetermined position on the substrate (7),

-    embedding of the chip (4) and of the track segment (3, 3') into the substrate (7).

The invention also refers to the placement device used in the process and to a

(56)    Documents Cited :    EP 694 871 A   FR 2 780 534 A

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